ISSN 1551-4897
Vol. 14, Issue 3, 2017July 01, 2017 EDT
Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density
Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density
Articles in Vol. 14, Issue 3, 2017
Vol. 14, Issue 3, 2017
- Combustion Heat MeterZbigniew Magonski
- Experimental Analysis of a Voice-Coil-Driven Jetting System for Micrograms Fluid Depositions in Electronics AssemblyRajiv L. IyerDaryl L. Santos
- Thin Thermally Efficient ICECool Defense Semiconductor Power AmplifiersSumeer KhannaPatrick McCluskeyAvram Bar-CohenBao YangMichael Ohadi
- Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit DensityRoland TackenDaniel MitcanJasper Nab
Tacken, Roland, Daniel Mitcan, and Jasper Nab. 2017. “Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density.” Journal of Microelectronics and Electronic Packaging 14 (3): 94–99. https://doi.org/10.4071/imaps.459344.