ISSN 1551-4897
Vol. 15, Issue 1, 2018January 01, 2018 EDT
Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis
Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis
Q: total heat dissipation (W)mw: mass flow rate on water side (kg/s)Cpw: specific heat of water (kJ/kg-K)ΔTw: temperature difference on the water side (°C)ma: mass flow rate on air side (kg/s)Cpa: specific heat of air (kJ/kg-K)ΔTa: temperature difference on the air side (°C)dp: static pressure drop (Pa)v˙: volumetric flow rate (m3/s)ΔP: fan pressure drop (Pa)Q: fan flow rate (CFM)μ: overall fan efficiency (%)
Articles in Vol. 15, Issue 1, 2018
Vol. 15, Issue 1, 2018
- High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0–300°C]Georg GläserDagmar KirstenAndré RichterMarco ReinhardGerrit KroppDirk M. Nuernbergk
- Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure AnalysisManasa SahiniDereje Agonafer
- Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature ApplicationsA. NovikovM. Nowottnick
- An Electronic Packaging Approach to Improving an Environmental Sensor and Sensing TechniqueRobert N. DeanRebecca E. Dean
- Multichip Module Planarity Requirements Derived From Solder Surface Tension ModelsThomas F. MarinisJoseph W. Soucy
Sahini, Manasa, and Dereje Agonafer. 2018. “Thermal Performance Evaluation of a New Close-Coupled Cooling Solution Including Cooling Failure Analysis.” Journal of Microelectronics and Electronic Packaging 15 (1): 21–34. https://doi.org/10.4071/imaps.528113.