ISSN 1551-4897
Vol. 15, Issue 1, 2018January 01, 2018 EDT
Multichip Module Planarity Requirements Derived From Solder Surface Tension Models
Multichip Module Planarity Requirements Derived From Solder Surface Tension Models
Articles in Vol. 15, Issue 1, 2018
Vol. 15, Issue 1, 2018
- High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0–300°C]Georg GläserDagmar KirstenAndré RichterMarco ReinhardGerrit KroppDirk M. Nuernbergk
- Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure AnalysisManasa SahiniDereje Agonafer
- Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature ApplicationsA. NovikovM. Nowottnick
- An Electronic Packaging Approach to Improving an Environmental Sensor and Sensing TechniqueRobert N. DeanRebecca E. Dean
- Multichip Module Planarity Requirements Derived From Solder Surface Tension ModelsThomas F. MarinisJoseph W. Soucy
Marinis, Thomas F., and Joseph W. Soucy. 2018. “Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.” Journal of Microelectronics and Electronic Packaging 15 (1): 9–20. https://doi.org/10.4071/imaps.526636.