ISSN 1551-4897
Vol. 8, Issue 3, 2011July 01, 2011 EDT
Novel Technology Options for Multilayer-Based Ceramic Microsystems
Novel Technology Options for Multilayer-Based Ceramic Microsystems
Articles in Vol. 8, Issue 3, 2011
Vol. 8, Issue 3, 2011
- Analysis, Design, and Optimization of Thermal In-Plane Microactuator—Chevron TypeK.B. PuneethK.N. Seetharamu
- Localized Temperature Stability in Multilayer LTCCSteve Dai
- A Novel Design of Substrate Integrated Waveguide (SIW) E-Plane Inductive Strip Filter Implemented Using LTCCEhab AbousaifAicha ElshabiniFred Barlow
- Novel Technology Options for Multilayer-Based Ceramic MicrosystemsUwe PartschAdrian GoldbergMartin IhleGunter HagenD. Arndt
- Compensation Scheme of a 50 Ω Bond Wire Interconnect Using Time Domain ReflectometryK. WebbH. Song
- New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman ThermographyM. FaqirA. ManoiT. MrotzekS. KnippscheerM. MassiotM. BuchtaH. BlanckS. RochetteO. VendierM. Kuball
Partsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen, and D. Arndt. 2011. “Novel Technology Options for Multilayer-Based Ceramic Microsystems.” Journal of Microelectronics and Electronic Packaging 8 (3): 95–101. https://doi.org/10.4071/imaps.292.