ISSN 1551-4897
Vol. 8, Issue 3, 2011July 01, 2011 EDT
Compensation Scheme of a 50 Ω Bond Wire Interconnect Using Time Domain Reflectometry
Compensation Scheme of a 50 Ω Bond Wire Interconnect Using Time Domain Reflectometry
Articles in Vol. 8, Issue 3, 2011
Vol. 8, Issue 3, 2011
- Analysis, Design, and Optimization of Thermal In-Plane Microactuator—Chevron TypeK.B. PuneethK.N. Seetharamu
- Localized Temperature Stability in Multilayer LTCCSteve Dai
- A Novel Design of Substrate Integrated Waveguide (SIW) E-Plane Inductive Strip Filter Implemented Using LTCCEhab AbousaifAicha ElshabiniFred Barlow
- Novel Technology Options for Multilayer-Based Ceramic MicrosystemsUwe PartschAdrian GoldbergMartin IhleGunter HagenD. Arndt
- Compensation Scheme of a 50 Ω Bond Wire Interconnect Using Time Domain ReflectometryK. WebbH. Song
- New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman ThermographyM. FaqirA. ManoiT. MrotzekS. KnippscheerM. MassiotM. BuchtaH. BlanckS. RochetteO. VendierM. Kuball
Webb, K., and H. Song. 2011. “Compensation Scheme of a 50 Ω Bond Wire Interconnect Using Time Domain Reflectometry.” Journal of Microelectronics and Electronic Packaging 8 (3): 114–20. https://doi.org/10.4071/imaps.301.