ISSN 1551-4897
Vol. 9, Issue 2, 2012April 01, 2012 EDT
Reliability of Embedded Ultrathin Chips Subjected to Cyclic Stresses
Reliability of Embedded Ultrathin Chips Subjected to Cyclic Stresses
Articles in Vol. 9, Issue 2, 2012
Vol. 9, Issue 2, 2012
- Reliability of Embedded Ultrathin Chips Subjected to Cyclic StressesFerdous SarwarVal R. Marinov
- Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board DesignsDarryl KostkaAntonio Ciccomancini Scogna
- Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive ApplicationTu Anh TranVarughese MathewHarold Downey
- LTCC Based Microfluidic Mass Flow Sensor ConceptChristian ZeilmannThomas HaasAndreas BackesUlrich Schmid
- Transfer Molding Technology for Smart Power Electronics Modules: Materials and ProcessesK.-F. BeckerD. JoklitschkeT. BraunM. KochT. ThomasT. Schreier-AltV. BaderJ. BauerT. NowakO. Bochow-NessR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)Heng-Chieh ChienJohn H. LauYu-Lin ChaoRa-Min TainMing-Ji DaiSheng-Tsai WuWei-Chung LoMing-Jer Kao
Sarwar, Ferdous, and Val R. Marinov. 2012. “Reliability of Embedded Ultrathin Chips Subjected to Cyclic Stresses.” Journal of Microelectronics and Electronic Packaging 9 (2): 104–11. https://doi.org/10.4071/imaps.330.