ISSN 1551-4897
Vol. 9, Issue 4, 2012October 01, 2012 EDT
Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer
Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer
Articles in Vol. 9, Issue 4, 2012
Vol. 9, Issue 4, 2012
- Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin TransferQuanling ZhengM. Ashraf KhanAlfred M. KrimanGary H. Bernstein
- Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary BridgingThomas BrunschwilerGerd SchlottigSongbo NiYu LiuJavier V. GoicocheaJonas ZürcherHeiko Wolf
- Design, Fabrication, and Operation of a Nitrogen Monoxide Measurement Device Based on LTCCThomas GeilingTilo WelkerChristiane EhrlingJens Müller
- Millimeter-Wave Frequency Performance of Conductor-Backed Coplanar Waveguide on FR408 Packaging MaterialSupreetha AroorRashaunda Henderson
- All-Dielectric Metamaterials for New Areas of ApplicationElena SemouchkinaGeorge SemouchkinMichael Lanagan
- Inkjet Printing Technology: A Novel Bottom-up Approach for Multilayer Ceramic Components and High Definition Printed Electronic DevicesC. Dossou-YovoM. MougenotE. BeaudrouetM. BessaudouN. BernardinF. CharifiC. CoquetM. BorellaR. NogueraC. ModesM. LejeuneP. LaurierD. DetemmermanP. EscureH. LavilleN. DelhotesS. Verdeymes
Zheng, Quanling, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein. 2012. “Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer.” Journal of Microelectronics and Electronic Packaging 9 (4): 160–65. https://doi.org/10.4071/imaps.359.