ISSN 1551-4897
Vol. 9, Issue 4, 2012October 01, 2012 EDT
Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf,
Capillary bridgingcentrifugationhierarchical self-assemblyneck formationpercolating thermal underfillsequential processing
Articles in Vol. 9, Issue 4, 2012
Vol. 9, Issue 4, 2012
- Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin TransferQuanling ZhengM. Ashraf KhanAlfred M. KrimanGary H. Bernstein
- Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary BridgingThomas BrunschwilerGerd SchlottigSongbo NiYu LiuJavier V. GoicocheaJonas ZürcherHeiko Wolf
- Design, Fabrication, and Operation of a Nitrogen Monoxide Measurement Device Based on LTCCThomas GeilingTilo WelkerChristiane EhrlingJens Müller
- Millimeter-Wave Frequency Performance of Conductor-Backed Coplanar Waveguide on FR408 Packaging MaterialSupreetha AroorRashaunda Henderson
- All-Dielectric Metamaterials for New Areas of ApplicationElena SemouchkinaGeorge SemouchkinMichael Lanagan
- Inkjet Printing Technology: A Novel Bottom-up Approach for Multilayer Ceramic Components and High Definition Printed Electronic DevicesC. Dossou-YovoM. MougenotE. BeaudrouetM. BessaudouN. BernardinF. CharifiC. CoquetM. BorellaR. NogueraC. ModesM. LejeuneP. LaurierD. DetemmermanP. EscureH. LavilleN. DelhotesS. Verdeymes
Brunschwiler, Thomas, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, and Heiko Wolf. 2012. “Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging.” Journal of Microelectronics and Electronic Packaging 9 (4): 149–59. https://doi.org/10.4071/imaps.357.