ISSN 1551-4897
Vol. 7, Issue 4, 2010October 01, 2010 EDT
Application of a Flow Optimizer in a Limited Space to Increase Series Fan Performance
Application of a Flow Optimizer in a Limited Space to Increase Series Fan Performance
Articles in Vol. 7, Issue 4, 2010
Vol. 7, Issue 4, 2010
- Application of a Flow Optimizer in a Limited Space to Increase Series Fan PerformanceJonathan JilesenHoward HarrisonFue-Sang LienDarryl McCumber
- A Multistep Process for Thinning Individual Die to sub-35 μm ThicknessJeffrey ThompsonGary TepoltLivia RaczC.B. RogersV.P. MannoR.D. White
- Inkjet Printing of Fine-Line Thick-Film InductorsMarcel WassmerWaldemar DielKlaus Krueger
- Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer HandlingM. P. ZussmanC. MilasincicA. RardinS. KirkT. Itabashi
- Advanced SiP Packaging Technologies of IPD for Mobile ApplicationsMeenakshi PrashantSeung Wook YoonGeunSik KimKai LiuFlynn Carson
- The LTCC Chip for Electrochemical Measurement of DNA ConcentrationPaweł BembnowiczPiotr HerbutPatryk HalekHelena TeteryczLeszek J. GolonkaMałgorzata MałodobraTadeusz Dobosz
- Analysis of Refrigeration Requirements of Digital Processors in Subambient TemperaturesWon Ho ParkTamer AliC. K. Ken Yang
Jilesen, Jonathan, Howard Harrison, Fue-Sang Lien, and Darryl McCumber. 2010. “Application of a Flow Optimizer in a Limited Space to Increase Series Fan Performance.” Journal of Microelectronics and Electronic Packaging 7 (4): 181–88. https://doi.org/10.4071/imaps.255.