ISSN 1551-4897
Vol. 7, Issue 4, 2010October 01, 2010 EDT
A Multistep Process for Thinning Individual Die to sub-35 μm Thickness
A Multistep Process for Thinning Individual Die to sub-35 μm Thickness
Articles in Vol. 7, Issue 4, 2010
Vol. 7, Issue 4, 2010
- Application of a Flow Optimizer in a Limited Space to Increase Series Fan PerformanceJonathan JilesenHoward HarrisonFue-Sang LienDarryl McCumber
- A Multistep Process for Thinning Individual Die to sub-35 μm ThicknessJeffrey ThompsonGary TepoltLivia RaczC.B. RogersV.P. MannoR.D. White
- Inkjet Printing of Fine-Line Thick-Film InductorsMarcel WassmerWaldemar DielKlaus Krueger
- Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer HandlingM. P. ZussmanC. MilasincicA. RardinS. KirkT. Itabashi
- Advanced SiP Packaging Technologies of IPD for Mobile ApplicationsMeenakshi PrashantSeung Wook YoonGeunSik KimKai LiuFlynn Carson
- The LTCC Chip for Electrochemical Measurement of DNA ConcentrationPaweł BembnowiczPiotr HerbutPatryk HalekHelena TeteryczLeszek J. GolonkaMałgorzata MałodobraTadeusz Dobosz
- Analysis of Refrigeration Requirements of Digital Processors in Subambient TemperaturesWon Ho ParkTamer AliC. K. Ken Yang
Thompson, Jeffrey, Gary Tepolt, Livia Racz, C.B. Rogers, V.P. Manno, and R.D. White. 2010. “A Multistep Process for Thinning Individual Die to Sub-35 Μm Thickness.” Journal of Microelectronics and Electronic Packaging 7 (4): 189–96. https://doi.org/10.4071/imaps.256.