All Articles tagged Thinning
- General
January 01, 2024 EDT The concept of chiplet was proposed in the post- Moore era.
- General
October 01, 2010 EDT The drive toward increased packaging density relies on die stacking. In order to maximize functional density, die are generally thinned on the wafer level. However, high-cost low-volume applications may not...
- General
July 01, 2007 EDT Wafer thinning has been effectively used to improve heat dissipation in power devices and to fabricate flexible substrates, small chip packages, and multiple chips in a package. Wafer handling has...
- General
April 01, 2006 EDT The present trend in electronics packaging is the stacking of die at the wafer or chip level. However to ensure stacked chip packages maintain overall low height and weight package...