ISSN 1551-4897
Vol. 3, Issue 2, 2006April 01, 2006 EDT
A Systematic Approach to Thinning Silicon Wafers to the sub-40μm Thickness Range
A Systematic Approach to Thinning Silicon Wafers to the sub-40μm Thickness Range
Articles in Vol. 3, Issue 2, 2006
Vol. 3, Issue 2, 2006
- Simulation of Mold Filling for Non-Newtonian Fluids - Part 2Venkatesh M. KulkarniChu Wee LiangC.W. TanP.A. Aswatha NarayanaK.N. Seetharamu
- New Analytical Model for the Dielectric Loss of Microstrip Lines on Multilayer Dielectric Substrates: Effect of Conductor-Dielectric InterphaseHung T. VoFrank G. Shi
- Impact of Geometric Parameters of Capillary Design on Quality of Gold Ball BondingJerry Chih-Tsong SuCheng-Hsiang Yu
- Chip-On-ACB (Anodized Circuit Board) Package for High Power Light-Emitting DiodeKyuho ShinSuho ShinSoon Cheol KweonKihwan KwonSeogmoon ChoiYoungki Lee
- Experimental characterization of thermoelectric properties of thick film compositesPiotr MarkowskiAndrzej Dziedzic
- A Systematic Approach to Thinning Silicon Wafers to the sub-40μm Thickness RangeParthiban ArunasalamMatthew H. GordonLeonard W. Schaper
Arunasalam, Parthiban, Matthew H. Gordon, and Leonard W. Schaper. 2006. “A Systematic Approach to Thinning Silicon Wafers to the Sub-40μm Thickness Range.” Journal of Microelectronics and Electronic Packaging 3 (2): 86–94. https://doi.org/10.4071/1551-4897-3.2.86.