ISSN 1551-4897
Vol. 3, Issue 2, 2006April 01, 2006 EDT
Experimental characterization of thermoelectric properties of thick film composites
Experimental characterization of thermoelectric properties of thick film composites
Articles in Vol. 3, Issue 2, 2006
Vol. 3, Issue 2, 2006
- Simulation of Mold Filling for Non-Newtonian Fluids - Part 2Venkatesh M. KulkarniChu Wee LiangC.W. TanP.A. Aswatha NarayanaK.N. Seetharamu
- New Analytical Model for the Dielectric Loss of Microstrip Lines on Multilayer Dielectric Substrates: Effect of Conductor-Dielectric InterphaseHung T. VoFrank G. Shi
- Impact of Geometric Parameters of Capillary Design on Quality of Gold Ball BondingJerry Chih-Tsong SuCheng-Hsiang Yu
- Chip-On-ACB (Anodized Circuit Board) Package for High Power Light-Emitting DiodeKyuho ShinSuho ShinSoon Cheol KweonKihwan KwonSeogmoon ChoiYoungki Lee
- Experimental characterization of thermoelectric properties of thick film compositesPiotr MarkowskiAndrzej Dziedzic
- A Systematic Approach to Thinning Silicon Wafers to the sub-40μm Thickness RangeParthiban ArunasalamMatthew H. GordonLeonard W. Schaper
Markowski, Piotr, and Andrzej Dziedzic. 2006. “Experimental Characterization of Thermoelectric Properties of Thick Film Composites.” Journal of Microelectronics and Electronic Packaging 3 (2): 95–99. https://doi.org/10.4071/1551-4897-3.2.95.