ISSN 1551-4897
Vol. 3, Issue 2, 2006April 01, 2006 EDT
Simulation of Mold Filling for Non-Newtonian Fluids - Part 2
Simulation of Mold Filling for Non-Newtonian Fluids - Part 2
Articles in Vol. 3, Issue 2, 2006
Vol. 3, Issue 2, 2006
- Simulation of Mold Filling for Non-Newtonian Fluids - Part 2Venkatesh M. KulkarniChu Wee LiangC.W. TanP.A. Aswatha NarayanaK.N. Seetharamu
- New Analytical Model for the Dielectric Loss of Microstrip Lines on Multilayer Dielectric Substrates: Effect of Conductor-Dielectric InterphaseHung T. VoFrank G. Shi
- Impact of Geometric Parameters of Capillary Design on Quality of Gold Ball BondingJerry Chih-Tsong SuCheng-Hsiang Yu
- Chip-On-ACB (Anodized Circuit Board) Package for High Power Light-Emitting DiodeKyuho ShinSuho ShinSoon Cheol KweonKihwan KwonSeogmoon ChoiYoungki Lee
- Experimental characterization of thermoelectric properties of thick film compositesPiotr MarkowskiAndrzej Dziedzic
- A Systematic Approach to Thinning Silicon Wafers to the sub-40μm Thickness RangeParthiban ArunasalamMatthew H. GordonLeonard W. Schaper
Kulkarni, Venkatesh M., Chu Wee Liang, C.W. Tan, P.A. Aswatha Narayana, and K.N. Seetharamu. 2006. “Simulation of Mold Filling for Non-Newtonian Fluids - Part 2.” Journal of Microelectronics and Electronic Packaging 3 (2): 52–60. https://doi.org/10.4071/1551-4897-3.2.52.