A Multistep Process for Thinning Individual Die to sub-35 μm Thickness

Thompson, Jeffrey, Gary Tepolt, Livia Racz, C.B. Rogers, V.P. Manno, and R.D. White. 2010. “A Multistep Process for Thinning Individual Die to Sub-35 Μm Thickness.” Journal of Microelectronics and Electronic Packaging 7 (4): 189–96. https://doi.org/10.4071/imaps.256.