ISSN 1551-4897
Vol. 7, Issue 3, 2010July 01, 2010 EDT
Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill
Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill
Articles in Vol. 7, Issue 3, 2010
Vol. 7, Issue 3, 2010
- Integration of Electrografted Layers for the Metallization of Deep TSVsF. RaynalV. MevellecN. FrederichD. SuhrI. BispoB. CouturierC. Truzzi
- Fabrication and Electrical Evaluation of Via Last Polymer Liner TSVsDeniz S. TezcanBivragh MajeedYann CivalePhilippe SoussanEric Beyne
- Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing AdhesiveAlan HuffmanChristopher GregoryMatthew LueckJason ReedDorota TempleRuss Stapleton
- Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow UnderfillZhaozhi LiSangil LeeBrian J. LewisPaul N. HoustonDaniel F. BaldwinEugene A. StoutTheodore G. TessierJohn L. Evans
- Advances in WLCSP Technologies to Enable Cost ReductionR. ChilukuriR. AndersonB. RogersA. Syed
- Wafer Level Packaging of Compound SemiconductorsAndrew StrandjordThorsten TeutschAxel SchefflerBernd OttoAnna PaatOscar AlinabonJing Li
- Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach MaterialPaul PanaccioneTao WangXu ChenSusan LuoGuo-Quan Lu
- Development of MEMS Power Sensor PackageBruce C. KimRahim Kasim
- Next Generation System in a Package Manufacturing by Embedded Chip TechnologiesLars BoettcherD. ManessisS. KaraszkiewiczA. OstmannH. Reichl
- ZoneBOND Thin Wafer Support Process for Wafer Bonding ApplicationsJeremy McCutcheonRobert BrownJoElle Dachsteiner
- A Robust Thin-Film Wafer-Level Packaging Approach for MEMS DevicesKrishnan SeetharamanBart van VelzenJohannes van WingerdenHans van ZadelhoffCadmus YuanFrank RietveldCoen TakJoost van BeekPeter H.C. MagnéeHerman C.W. Beijerinck
Li, Zhaozhi, Sangil Lee, Brian J. Lewis, Paul N. Houston, Daniel F. Baldwin, Eugene A. Stout, Theodore G. Tessier, and John L. Evans. 2010. “Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill.” Journal of Microelectronics and Electronic Packaging 7 (3): 146–51. https://doi.org/10.4071/imaps.262.