ISSN 1551-4897
Vol. 6, Issue 3, 2009July 01, 2009 EDT
Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization
Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization
Articles in Vol. 6, Issue 3, 2009
Vol. 6, Issue 3, 2009
- Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip ApplicationsSean M. ChinenMatthew T. Siniawski
- Vertical Arrays of Copper Nanotube Grown on Silicon Substrate by CMOS Compatible Electrochemical Process for IC Packaging ApplicationsDaniel ChoiViola FucskoE. H. YangJung-Rae ParkFahad KhalidYoung-Kun Kim
- Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and MicrosystemsStanislav SlosarčíkIgor VehecAlexander GmiterkoPavol CabúkMichal Jurčišin
- Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS DeviceChad B. O'NealAjay P. MalsheWilliam F. SchmidtMatthew H. GordonWilliam D. Brown
- Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer PackagesRadosvet G. Arnaudov
- Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability OptimizationV. MarquesC. JohnstonP.S. Grant
Marques, V., C. Johnston, and P.S. Grant. 2009. “Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization.” Journal of Microelectronics and Electronic Packaging 6 (3): 182–85. https://doi.org/10.4071/1551-4897-6.3.182.