ISSN 1551-4897
Vol. 6, Issue 3, 2009July 01, 2009 EDT
Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device
Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device
Articles in Vol. 6, Issue 3, 2009
Vol. 6, Issue 3, 2009
- Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip ApplicationsSean M. ChinenMatthew T. Siniawski
- Vertical Arrays of Copper Nanotube Grown on Silicon Substrate by CMOS Compatible Electrochemical Process for IC Packaging ApplicationsDaniel ChoiViola FucskoE. H. YangJung-Rae ParkFahad KhalidYoung-Kun Kim
- Technology and Application of 3D Shaped LTCC Modules for Pressure Sensors and MicrosystemsStanislav SlosarčíkIgor VehecAlexander GmiterkoPavol CabúkMichal Jurčišin
- Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS DeviceChad B. O'NealAjay P. MalsheWilliam F. SchmidtMatthew H. GordonWilliam D. Brown
- Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer PackagesRadosvet G. Arnaudov
- Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability OptimizationV. MarquesC. JohnstonP.S. Grant
O’Neal, Chad B., Ajay P. Malshe, William F. Schmidt, Matthew H. Gordon, and William D. Brown. 2009. “Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device.” Journal of Microelectronics and Electronic Packaging 6 (3): 164–71. https://doi.org/10.4071/1551-4897-6.3.164.