ISSN 1551-4897
Articles in Vol. 4, Issue 4, 2007
Vol. 4, Issue 4, 2007
- Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS/Hershel at Liquid Helium TemperaturePatrick MerkenTim SouverijnsJan PutzeysYbe CretenChris Van Hoof
- Development and Manufacture of a Linear 16-Pixel FIR Array—The PACS ModuleHilmar H. RichterMichael HarrPeter DingesHeribert KrügerAlexandra TodiscoBernd Zimmermann
- Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (−190 and −120°C)Rajeshuni Ramesham
- Kinetic Modeling of LTCC Shrinkage: Effect of Alumina ContentM. EbersteinR. MüllerS. ReinschT. RabeW.A. SchillerA. ThielJ. Deubener
- Design and Implementation of Baluns at 60 GHz on LTCCSven RentschJens Müller
- Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint ReliabilityC.I. ChenS.C. WuD.S. LiuC.Y. NiT. D. Yuan
- Testing of the Mars Exploration Rovers to Survive the Extreme Thermal EnvironmentsKin F. ManAlan R. Hoffman
- LTCC-based Fluidic Components for Chemical ApplicationsT. ThelemannM. FischerA. GroßJ. Müller
Thelemann, T., M. Fischer, A. Groß, and J. Müller. 2007. “LTCC-Based Fluidic Components for Chemical Applications.” Journal of Microelectronics and Electronic Packaging 4 (4): 167–72. https://doi.org/10.4071/1551-4897-4.4.167.