ISSN 1551-4897
Vol. 4, Issue 4, 2007October 01, 2007 EDT
Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS/Hershel at Liquid Helium Temperature
Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS/Hershel at Liquid Helium Temperature
Articles in Vol. 4, Issue 4, 2007
Vol. 4, Issue 4, 2007
- Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS/Hershel at Liquid Helium TemperaturePatrick MerkenTim SouverijnsJan PutzeysYbe CretenChris Van Hoof
- Development and Manufacture of a Linear 16-Pixel FIR Array—The PACS ModuleHilmar H. RichterMichael HarrPeter DingesHeribert KrügerAlexandra TodiscoBernd Zimmermann
- Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (−190 and −120°C)Rajeshuni Ramesham
- Kinetic Modeling of LTCC Shrinkage: Effect of Alumina ContentM. EbersteinR. MüllerS. ReinschT. RabeW.A. SchillerA. ThielJ. Deubener
- Design and Implementation of Baluns at 60 GHz on LTCCSven RentschJens Müller
- Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint ReliabilityC.I. ChenS.C. WuD.S. LiuC.Y. NiT. D. Yuan
- Testing of the Mars Exploration Rovers to Survive the Extreme Thermal EnvironmentsKin F. ManAlan R. Hoffman
- LTCC-based Fluidic Components for Chemical ApplicationsT. ThelemannM. FischerA. GroßJ. Müller
Merken, Patrick, Tim Souverijns, Jan Putzeys, Ybe Creten, and Chris Van Hoof. 2007. “Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS/Hershel at Liquid Helium Temperature.” Journal of Microelectronics and Electronic Packaging 4 (4): 130–35. https://doi.org/10.4071/1551-4897-4.4.130.