ISSN 1551-4897
Vol. 2, Issue 4, 2005October 01, 2005 EDT
Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages
Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages
Articles in Vol. 2, Issue 4, 2005
Vol. 2, Issue 4, 2005
- Micromachined Vibration Isolation Filters to Enhance Packaging for Mechanically Harsh EnvironmentsRobert DeanGeorge FlowersNicole SandersRoland HorvathMichael KranzMichael Whitley
- Electrical approach to Nondestructive Analysis on WB-PBGA with TDR TechnologyMing-Kun ChenCheng-Chi TaiYu-Jung Huang
- Thermal Design Optimization of Optoelectronic PackageN. Aizar A. KarimP.A. Aswatha NarayanaK.N. Seetharamu
- Experimental Evaluation of Glob-top Materials for use in Harsh EnvironmentsMats LindgrenIlja BelovPeter Leisner
- Reliability of anisotropic conductive joints for bumpless flip-chip on flex packages under thermal stressesLafir AliY. C. ChanM.O. Alam
- Development of Biocompatible MEMS Wireless Capacitive Pressure SensorShankaran JanardhananJoan. Z. DelalicJeffrey CatchmarkDharanipal Saini
- Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packagesSee Bee KeeLuay B HussainKesavan NairYL KhongDennis Chandran Prem Kumar
Kee, See Bee, Luay B Hussain, Kesavan Nair, YL Khong, and Dennis Chandran Prem Kumar. 2005. “Effects of Gold on the Properties of Tin-Antimony Solder in Flip-Chip-Pin-Grid-Array (FCGPA) Packages.” Journal of Microelectronics and Electronic Packaging 2 (4): 281–86. https://doi.org/10.4071/1551-4897-2.4.281.