ISSN 1551-4897
Vol. 2, Issue 4, 2005October 01, 2005 EDT
Thermal Design Optimization of Optoelectronic Package
Thermal Design Optimization of Optoelectronic Package
Articles in Vol. 2, Issue 4, 2005
Vol. 2, Issue 4, 2005
- Micromachined Vibration Isolation Filters to Enhance Packaging for Mechanically Harsh EnvironmentsRobert DeanGeorge FlowersNicole SandersRoland HorvathMichael KranzMichael Whitley
- Electrical approach to Nondestructive Analysis on WB-PBGA with TDR TechnologyMing-Kun ChenCheng-Chi TaiYu-Jung Huang
- Thermal Design Optimization of Optoelectronic PackageN. Aizar A. KarimP.A. Aswatha NarayanaK.N. Seetharamu
- Experimental Evaluation of Glob-top Materials for use in Harsh EnvironmentsMats LindgrenIlja BelovPeter Leisner
- Reliability of anisotropic conductive joints for bumpless flip-chip on flex packages under thermal stressesLafir AliY. C. ChanM.O. Alam
- Development of Biocompatible MEMS Wireless Capacitive Pressure SensorShankaran JanardhananJoan. Z. DelalicJeffrey CatchmarkDharanipal Saini
- Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packagesSee Bee KeeLuay B HussainKesavan NairYL KhongDennis Chandran Prem Kumar
Karim, N. Aizar A., P.A. Aswatha Narayana, and K.N. Seetharamu. 2005. “Thermal Design Optimization of Optoelectronic Package.” Journal of Microelectronics and Electronic Packaging 2 (4): 232–39. https://doi.org/10.4071/1551-4897-2.4.232.