ISSN 1551-4897
Vol. 18, Issue 4, 2021October 01, 2021 EDT
Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls
Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls
Articles in Vol. 18, Issue 4, 2021
Vol. 18, Issue 4, 2021
- State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid BondingJohn H Lau
- Designs for Reliability and Failure Mode Prevention of Electrical Feedthroughs in Integrated Downhole Logging ToolsHua XiaNelson SettlesMichael GrimmGaery RutherfordDavid DeWire
- Effect of High Temperature Storage on AC Characteristics of Polymer Tantalum CapacitorsAlexander Teverovsky
- Gallium-Nitride Field Effect Transistors in Extreme Temperature ConditionsMartijn S. DuraijYudi XiaoGabriel ZsurzsanZhe Zhang
- Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder BallsVishnu V. B. ReddyJaimal WilliamsonSuresh K. Sitaraman
Reddy, Vishnu V. B., Jaimal Williamson, and Suresh K. Sitaraman. 2021. “Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.” Journal of Microelectronics and Electronic Packaging 18 (4): 183–89. https://doi.org/10.4071/imaps.1501802.