ISSN 1551-4897
Vol. 2, Issue 2, 2005April 01, 2005 EDT
Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling
Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling
Articles in Vol. 2, Issue 2, 2005
Vol. 2, Issue 2, 2005
- Analysis and Optimization Of Single Layer Counter Flow Micro-Channel Heat SinkK. JeevanK. N. SeetharamuI. A. Azid
- Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure with Bond Material Used in Electronic PackagesD. SujanM. V. V. MurthyK. N. SeetharamuA. Y. Hassan
- Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave ProcessingTaehyun SungSue A. Bidstrup AllenPaul A. Kohl
- Progress in the Integration of planar and 3D Coils on LTCC by using photoimageable InksRubén PerroneHeiko ThustKarl-Heinz Drüe
- Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 2Cheang Soon YeeG.A. QuadirZ.A. ZainalK.N. Seetharamu
- Two-Phase Stacked Microchannel Heat Sinks for Microelectronics CoolingPradeep HegdeK.N. SeetharamuP.A. Aswatha NarayanaZulkifly Abdullah
Hegde, Pradeep, K.N. Seetharamu, P.A. Aswatha Narayana, and Zulkifly Abdullah. 2005. “Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling.” Journal of Microelectronics and Electronic Packaging 2 (2): 122–31. https://doi.org/10.4071/1551-4897-2.2.122.