ISSN 1551-4897
Vol. 18, Issue 1, 2021January 01, 2021 EDT
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
Articles in Vol. 18, Issue 1, 2021
Vol. 18, Issue 1, 2021
- Electromigration in Power Devices: A Combined Effect of Electromigration and Thermal MigrationHao ZhuangRobert BauerMarkus Dinkel
- A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D AssemblyGiovanni CapuzMelina LofranoCarine GeretsFabrice DuvalPieter BexJaber DerakhshandehKris VanstreelsAlain PhommahaxayEric BeyneAndy Miller
- Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor ApplicationsAbel MisrakTushar ChauhanRabin BhandariA S M Raufur ChowdhuryAkshay LakshminarayanaFahad MirzaB. Gholami BazehhourMilena VujosevicDereje Agonafer
- Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height UniformityRaihei IkumotoYuki ItakuraShinji TachibanaHisamitsu Yamamoto
Ikumoto, Raihei, Yuki Itakura, Shinji Tachibana, and Hisamitsu Yamamoto. 2021. “Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity.” Journal of Microelectronics and Electronic Packaging 18 (1): 7–11. https://doi.org/10.4071/imaps.1394260.