Vol. 18, Issue 1, 2021January 01, 2021 EDT
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
Ikumoto, Raihei, Yuki Itakura, Shinji Tachibana, and Hisamitsu Yamamoto. 2021. “Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity.” Journal of Microelectronics and Electronic Packaging 18 (1): 7–11. https://doi.org/10.4071/imaps.1394260.