A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly

Giovanni Capuz; Melina Lofrano; Carine Gerets; Fabrice Duval; Pieter Bex; Jaber Derakhshandeh; Kris Vanstreels; Alain Phommahaxay; Eric Beyne; Andy Miller

doi:10.4071/imaps.1391366

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Capuz, Giovanni, Melina Lofrano, Carine Gerets, Fabrice Duval, Pieter Bex, Jaber Derakhshandeh, Kris Vanstreels, Alain Phommahaxay, Eric Beyne, and Andy Miller. 2021. “A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly.” Journal of Microelectronics and Electronic Packaging 18 (1): 12–20. https://doi.org/10.4071/imaps.1391366.

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