ISSN 1551-4897
Vol. 17, Issue 1, 2020January 01, 2020 EDT
Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology
Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology
Articles in Vol. 17, Issue 1, 2020
Vol. 17, Issue 1, 2020
- Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) TechnologyLei FuMilind BhagavatCheryl SelvanayagamKen LeongIvor Barber
- Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale PackagesSimon SchambeckMatthias HutterJohannes JaeschkeAndrea DeutingerMartin Schneider-Ramelow
- A Technique for Detecting Moisture Absorption in Printed Circuit BoardsJeffery D. CravenAriel R. OldagRobert N. Dean
- High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding ApplicationsYuan ZhaoDoug KatzeJohn WoodBruno TollaHoward Yun
- Synthesis and Characterization of Physical Properties of MgO Thin Films by Various ConcentrationsNadjat ChaouchSaid BenramacheSaid Lakel
Fu, Lei, Milind Bhagavat, Cheryl Selvanayagam, Ken Leong, and Ivor Barber. 2020. “Cu Pillar Bump Development for 7-Nm Chip Package Interaction (CPI) Technology.” Journal of Microelectronics and Electronic Packaging 17 (1): 1–8. https://doi.org/10.4071/imaps.968260.