Vol. 18, Issue 1, 2021January 01, 2021 EDT
Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications
Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications
Abel Misrak, Tushar Chauhan, Rabin Bhandari, A S M Raufur Chowdhury, Akshay Lakshminarayana, Fahad Mirza, B. Gholami Bazehhour, Milena Vujosevic, Dereje Agonafer,
Misrak, Abel, Tushar Chauhan, Rabin Bhandari, A S M Raufur Chowdhury, Akshay Lakshminarayana, Fahad Mirza, B. Gholami Bazehhour, Milena Vujosevic, and Dereje Agonafer. 2021. “Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications.” Journal of Microelectronics and Electronic Packaging 18 (1): 21–28. https://doi.org/10.4071/imaps.1234982.