ISSN 1551-4897
Vol. 20, Issue 4, 2023October 01, 2023 EDT
A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling
A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling
Articles in Vol. 20, Issue 4, 2023
Vol. 20, Issue 4, 2023
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power ModulesDavid HuitinkWhit VinsonCollin RubyImam Al RaziDavid Agogo-MawuliAlan MantoothYarui Peng
- Dual-Band Dual-Polarized Antennas for 5G mmWave Base StationsThi H. LeIvan NdipMartin Schneider-Ramelow
- A Novel Approach for Characterizing Epoxy Mold Compound High Temperature SwellingIan ChinWei Keat LohMohd Zulkifly Bin Abdullah
Chin, Ian, Wei Keat Loh, and Mohd Zulkifly Bin Abdullah. 2023. “A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling.” Journal of Microelectronics and Electronic Packaging 20 (4): 123–29. https://doi.org/10.4071/001c.91225.