ISSN 1551-4897
Vol. 19, Issue 2, 2022June 01, 2022 EDT
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
Articles in Vol. 19, Issue 2, 2022
Vol. 19, Issue 2, 2022
- Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power ElectronicsBernhard CzernyGolta Khatibi
- Fine-Pitch Copper Pillar Flip Chips in High Reliability ApplicationsCatherine FarnumKaysar Rahim
- Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate PackageMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition ProcessesRalf SchmidtJens PalmChristian SchwarzJan M. Knaup
- An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability ApplicationsAimee M. MoreyScott PopelarJulie Hook
Czerny, Bernhard, and Golta Khatibi. 2022. “Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics.” Journal of Microelectronics and Electronic Packaging 19 (2): 49–55. https://doi.org/10.4071/imaps.1717134.