ISSN 1551-4897
Vol. 19, Issue 2, 2022June 01, 2022 EDT
Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate Package
Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate Package
Articles in Vol. 19, Issue 2, 2022
Vol. 19, Issue 2, 2022
- Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power ElectronicsBernhard CzernyGolta Khatibi
- Fine-Pitch Copper Pillar Flip Chips in High Reliability ApplicationsCatherine FarnumKaysar Rahim
- Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate PackageMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition ProcessesRalf SchmidtJens PalmChristian SchwarzJan M. Knaup
- An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability ApplicationsAimee M. MoreyScott PopelarJulie Hook
Matsuura, Masamitsu, Tanemasa Asano, and Haruichi Kanaya. 2022. “Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate Package.” Journal of Microelectronics and Electronic Packaging 19 (2): 65–70. https://doi.org/10.4071/imaps.1715287.