Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments

Bell, John, Laura Redmond, Kalind Carpenter, and Jean-Pierre de la Croix. 2022. “Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments.” Journal of Microelectronics and Electronic Packaging 19 (1): 25–38. https:/​/​doi.org/​10.4071/​imaps.1655356.