ISSN 1551-4897
Vol. 1, Issue 3, 2004July 01, 2004 EDT
Measurements of Thermal Conductivity of Thin Films by Means of Comparative Method
Measurements of Thermal Conductivity of Thin Films by Means of Comparative Method
Articles in Vol. 1, Issue 3, 2004
Vol. 1, Issue 3, 2004
- Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic ModuleXiang-jun ZengXu YangZhao-an Wang Xi'an
- Measurements of Thermal Conductivity of Thin Films by Means of Comparative MethodSelim AchmatowiczIwona WyżkiewiczElżbieta ZwierkowskaWojciech Łobodziński
- Contact Resistance of Anisotropic Conductive AdhesivesRanjith DivigalpitiyaPeter Hogerton
- A Tenfold Reduction in Interface Thermal Resistance for Heat Sink MountingD. Van HeerdenT.R. RudeJ. NewsonJ. HeE. BesnoinO.M. KnioT.P. Weihs
Achmatowicz, Selim, Iwona Wyżkiewicz, Elżbieta Zwierkowska, and Wojciech Łobodziński. 2004. “Measurements of Thermal Conductivity of Thin Films by Means of Comparative Method.” Journal of Microelectronics and Electronic Packaging 1 (3): 176–86. https://doi.org/10.4071/1551-4897-1.3.176.