ISSN 1551-4897
Vol. 1, Issue 3, 2004July 01, 2004 EDT
A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting
A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting
Articles in Vol. 1, Issue 3, 2004
Vol. 1, Issue 3, 2004
- Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic ModuleXiang-jun ZengXu YangZhao-an Wang Xi'an
- Measurements of Thermal Conductivity of Thin Films by Means of Comparative MethodSelim AchmatowiczIwona WyżkiewiczElżbieta ZwierkowskaWojciech Łobodziński
- Contact Resistance of Anisotropic Conductive AdhesivesRanjith DivigalpitiyaPeter Hogerton
- A Tenfold Reduction in Interface Thermal Resistance for Heat Sink MountingD. Van HeerdenT.R. RudeJ. NewsonJ. HeE. BesnoinO.M. KnioT.P. Weihs
Van Heerden, D., T.R. Rude, J. Newson, J. He, E. Besnoin, O.M. Knio, and T.P. Weihs. 2004. “A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting.” Journal of Microelectronics and Electronic Packaging 1 (3): 187–93. https://doi.org/10.4071/1551-4897-1.3.187.