ISSN 1551-4897
Vol. 1, Issue 3, 2004July 01, 2004 EDT
Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic Module
Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic Module
Articles in Vol. 1, Issue 3, 2004
Vol. 1, Issue 3, 2004
- Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic ModuleXiang-jun ZengXu YangZhao-an Wang Xi'an
- Measurements of Thermal Conductivity of Thin Films by Means of Comparative MethodSelim AchmatowiczIwona WyżkiewiczElżbieta ZwierkowskaWojciech Łobodziński
- Contact Resistance of Anisotropic Conductive AdhesivesRanjith DivigalpitiyaPeter Hogerton
- A Tenfold Reduction in Interface Thermal Resistance for Heat Sink MountingD. Van HeerdenT.R. RudeJ. NewsonJ. HeE. BesnoinO.M. KnioT.P. Weihs
Zeng, Xiang-jun, Xu Yang, and Zhao-an Wang Xi’an. 2004. “Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic Module.” Journal of Microelectronics and Electronic Packaging 1 (3): 169–75. https://doi.org/10.4071/1551-4897-1.3.169.