ISSN 1551-4897
Vol. 12, Issue 1, 2015January 01, 2015 EDT
Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology
Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology
Articles in Vol. 12, Issue 1, 2015
Vol. 12, Issue 1, 2015
- Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing BismuthJoseph M. JuarezPolina SnugovskyEva KosibaZohreh BagheriSubramaniam SuthakaranMichael RobinsonJoel HeebinkJeffrey KennedyMarianne Romansky
- Radio Frequency Microelectromechanical System-Platform Based on Silicon-Ceramic Composite SubstratesM. FischerS. GroppJ. NowakB. CapraroR. SommerM. HoffmannJ. Müller
- Development of a Stress Compensation Layer for 3-D Assembly of Thin Pixel ModulesG. ParesT. McMullenS. ToméL. VignoudR. BatesC. Buttar
- Impact of Bath Stability on Electroplated Cu for TSVs in a Controlled EnvironmentAnh NguyenKevin FealeyPeter ReillyGyanaranjan PattanaikAlison GraciasFred WafulaMichael FlynnJack Enloe
- A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic DevicesLilla Safford SmithGordon D. HoopleJim C. ChengAlbert P. Pisano
- Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma TechnologyRene SchrammThomas ReitbergerJoerg Franke
- Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing ProcessChao ZengChunqing WangYanhong TianChunjin HangWei LiuRong An
Schramm, Rene, Thomas Reitberger, and Joerg Franke. 2015. “Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology.” Journal of Microelectronics and Electronic Packaging 12 (1): 61–66. https://doi.org/10.4071/imaps.445.