ISSN 1551-4897
Vol. 13, Issue 1, 2016January 01, 2016 EDT
Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications
Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications
Articles in Vol. 13, Issue 1, 2016
Vol. 13, Issue 1, 2016
- Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different EnvironmentsRaul BermejoClemens KrautgasserMarco DelucaMartin PletzPeter SupancicFranz AldrianRobert Danzer
- Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power PackagesHao ZhangSimon S. Ang
- Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°CA. KelbererS. DreinerK. GrellaD. DittrichH. KappertH. VogtU. Paschen
- Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature ApplicationsPaul CroteauSayan SealRyan WitherellMichael GloverShashank KrishnamurthyAlan Mantooth
- SIP with TSV for Class 1 Medical DevicesYoungtak LeeDoug Link
Croteau, Paul, Sayan Seal, Ryan Witherell, Michael Glover, Shashank Krishnamurthy, and Alan Mantooth. 2016. “Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications.” Journal of Microelectronics and Electronic Packaging 13 (1): 6–16. https://doi.org/10.4071/imaps.492.