ISSN 1551-4897
Vol. 13, Issue 2, 2016April 01, 2016 EDT
A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology
A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology
Articles in Vol. 13, Issue 2, 2016
Vol. 13, Issue 2, 2016
- Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency ApplicationsZheng ChenYiying YaoWenli ZhangDushan BoroyevichKhai NgoPaolo MattavelliRolando Burgos
- Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic SubstratesBruce ChouWilliam VisRyuta FuruyaVenky SundaramRao Tummala
- A New In-Line Laser-Based Acoustic Technique for Pillar Bump MetrologyTodd W. MurrayAndrew BakirDavid M. StobbeMichael J. KotelyanskiiRobin A. MairManjusha MehendaleXueping RuJonathan D. CohenMichelle T. SchulbergPriya MukundhanTimothy J. Kryman
- Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic StimulationCaroline K. BjuneThomas F. MarinisTirunelveli S. SriramJeanne M. BradyJames MoranPhilip D. ParksAlik S. WidgeDarin D. DoughertyEmad N. Eskandar
- Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D InterconnectionColin McDonoughDoug La TulipeDan PascualPaul TarielloJohn MucciMatt SmalleyAnh NguyenTuan VoCorbet JohnsonPhung NguyenJeremiah HebdingGerald LeakeMichele MorescErman TimurdoganVladimir StojanovićMichael R. WattsDouglas Coolbaugh
Murray, Todd W., Andrew Bakir, David M. Stobbe, Michael J. Kotelyanskii, Robin A. Mair, Manjusha Mehendale, Xueping Ru, et al. 2016. “A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology.” Journal of Microelectronics and Electronic Packaging 13 (2): 58–63. https://doi.org/10.4071/imaps.501.