ISSN 1551-4897
Vol. 13, Issue 3, 2016July 01, 2016 EDT
Impact of Metallurgical and Mechanical Properties of Sintered Silver Joints on Die-Attach Reliability of High-Temperature Power Modules
Impact of Metallurgical and Mechanical Properties of Sintered Silver Joints on Die-Attach Reliability of High-Temperature Power Modules
Articles in Vol. 13, Issue 3, 2016
Vol. 13, Issue 3, 2016
- Additive Manufacturing Design and Fabrication of Ceramic Cylindrical Ion Trap Mass Analyzer Chips for Miniaturized Mass Spectrometer Smart-Device (Internet of Things) ApplicationsPatrick RomanXudong ChenW. Kinzy JonesA. KarbasiC. Mike NewtonTravis BatesJacob DenkinsShekhar Bhansali
- High-Permittivity and Low-Loss Electromagnetic Composites Based on Co-fired Ba0.55Sr0.45TiO3 or MgCaTiO2 Microfillers for Additive Manufacturing and Their Application to 3-D Printed K-Band AntennasJuan CastroEduardo RojasThomas WellerJing Wang
- Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-μm Bump PitchBrett SawyerYuya SuzukiZihan WuHao LuVenky SundaramKadappan PanayappanRao Tummala
- Round-Robin of High-Frequency Test Methods by IPC-D24C Task GroupGlenn OliverJonathan WeldonChudy NwachukwuJohn AndresakisJohn CoonrodDavid L. WynantsDon DeGroot
- Thermodynamic Analysis of Physical Vapor Deposited Inorganic Thin Films on Low Temperature Cofired CeramicCarol PutmanRachel Cramm HornJ. Ambrose WolfDaniel Krueger
- Impact of Metallurgical and Mechanical Properties of Sintered Silver Joints on Die-Attach Reliability of High-Temperature Power ModulesHiroaki TatsumiSho KumadaAtsushi FukudaHiroshi YamaguchiYoshihiro Kashiba
- Thick Film Process Characterization for Thin Film Metallized LTCCM. A. GirardiK. A. PetersonP. T. Vianco
Tatsumi, Hiroaki, Sho Kumada, Atsushi Fukuda, Hiroshi Yamaguchi, and Yoshihiro Kashiba. 2016. “Impact of Metallurgical and Mechanical Properties of Sintered Silver Joints on Die-Attach Reliability of High-Temperature Power Modules.” Journal of Microelectronics and Electronic Packaging 13 (3): 121–27. https://doi.org/10.4071/imaps.506.