ISSN 1551-4897
Vol. 14, Issue 1, 2017January 01, 2017 EDT
Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics
Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics
Articles in Vol. 14, Issue 1, 2017
Vol. 14, Issue 1, 2017
- Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus CouplersLukas LorenzKrzysztof NieweglowskiKlaus-Jürgen WolterFlorian LoosenNorbert LindleinKarlheinz Bock
- Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature MicroelectronicsLiang-Yu ChenPhilip G. NeudeckDavid J. SpryGlenn M. BeheimGary W. Hunter
- A Resistive GaN-HEMT Mixer for a Cable Modem Operable up to 250°C for Downhole CommunicationsJebreel M. SalemDong Sam Ha
- Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch InterconnectC. Marsan-LoyerD. DanovitchN. Boyer
- Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic InterposerKazuyuki MitsukuraMasaya TobaKousuke UrashimaYoshinori EjiriKenichi IwashitaTomonori MinegishiKazuhiko Kurafuchi
- Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device ProcessingXiao LiuQi WuDongshun BaiTrevor StanleyAlvin LeeJay SuBaron Huang
Chen, Liang-Yu, Philip G. Neudeck, David J. Spry, Glenn M. Beheim, and Gary W. Hunter. 2017. “Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics.” Journal of Microelectronics and Electronic Packaging 14 (1): 11–16. https://doi.org/10.4071/imaps.529.