ISSN 1551-4897
Vol. 14, Issue 1, 2017January 01, 2017 EDT
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer
Kazuyuki Mitsukura, Masaya Toba, Kousuke Urashima, Yoshinori Ejiri, Kenichi Iwashita, Tomonori Minegishi, Kazuhiko Kurafuchi,
Articles in Vol. 14, Issue 1, 2017
Vol. 14, Issue 1, 2017
- Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus CouplersLukas LorenzKrzysztof NieweglowskiKlaus-Jürgen WolterFlorian LoosenNorbert LindleinKarlheinz Bock
- Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature MicroelectronicsLiang-Yu ChenPhilip G. NeudeckDavid J. SpryGlenn M. BeheimGary W. Hunter
- A Resistive GaN-HEMT Mixer for a Cable Modem Operable up to 250°C for Downhole CommunicationsJebreel M. SalemDong Sam Ha
- Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch InterconnectC. Marsan-LoyerD. DanovitchN. Boyer
- Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic InterposerKazuyuki MitsukuraMasaya TobaKousuke UrashimaYoshinori EjiriKenichi IwashitaTomonori MinegishiKazuhiko Kurafuchi
- Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device ProcessingXiao LiuQi WuDongshun BaiTrevor StanleyAlvin LeeJay SuBaron Huang
Mitsukura, Kazuyuki, Masaya Toba, Kousuke Urashima, Yoshinori Ejiri, Kenichi Iwashita, Tomonori Minegishi, and Kazuhiko Kurafuchi. 2017. “Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer.” Journal of Microelectronics and Electronic Packaging 14 (1): 26–31. https://doi.org/10.4071/imaps.348184.