ISSN 1551-4897
Vol. 15, Issue 2, 2018April 01, 2018 EDT
Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al2O3/K2O3–B2O3–SiO2 Composite Ceramics for LTCC Applications
Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al2O3/K2O3–B2O3–SiO2 Composite Ceramics for LTCC Applications
Articles in Vol. 15, Issue 2, 2018
Vol. 15, Issue 2, 2018
- Equivalent Capacitance Approach to Calculate Effective Roughness Dielectric Parameters for Copper Foils on Printed Circuit BoardsMarina Y. KoledintsevaTracey Vincent
- Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al2O3/K2O3–B2O3–SiO2 Composite Ceramics for LTCC ApplicationsZhe SongJoanna ChuKun HuangLasse NorénZhenxiao FuYun Liu
- LTCC-Based Highly Integrated SiPM Module with Integrated Liquid Cooling Channels for High Resolution Molecular ImagingRainer DohleIlaria SaccoThomas RittwegThomas FriedrichGerold HenningJörg GoßlerPeter Fischer
- Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by NanoindentationAbel MisrakLuu NguyenSteven KummerlDereje Agonafer
- Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical ReviewDinesh P. R. ThanuBoxi LiuMarco Aurelio Cartas
- Dark Current Leakage in Optoelectronic Hermetic PackagesClara DionetGoran PerosevicJeff JavierSammie FernandezTaylor HurdleMaziar MoradiAndrew NeelyKevin MaMarwan Albarghouti
Song, Zhe, Joanna Chu, Kun Huang, Lasse Norén, Zhenxiao Fu, and Yun Liu. 2018. “Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al2O3/K2O3–B2O3–SiO2 Composite Ceramics for LTCC Applications.” Journal of Microelectronics and Electronic Packaging 15 (2): 81–85. https://doi.org/10.4071/imaps.606076.