ISSN 1551-4897
Vol. 15, Issue 3, 2018July 01, 2018 EDT
3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components
3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components
Articles in Vol. 15, Issue 3, 2018
Vol. 15, Issue 3, 2018
- 3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF ComponentsZihan WuJunki MinMarkondeya Raj PulugurthaSiddharth RavichandranVenky SundaramRao R. Tummala
- A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered ArrangementBharath R. BharadwajSriNithish KandagadlaPraveen J. NadkarniV. KrishnaT. R. SeetharamK. N. Seetharamu
- Reliability of Novel Ceramic Encapsulation Materials for Electronic PackagingStefan KaessnerMarkus G. ScheibelStefan BehrendtBianca BoettgeChristoph BertholdKlaus G. Nickel
- Thermal Stress Analysis for High CRI LED Indoor Lighting ModuleJonghwan LeeKi-Youn Kwon
- Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless PackagingBijan K. TehraniRyan A. BahrManos M. Tentzeris
Wu, Zihan, Junki Min, Markondeya Raj Pulugurtha, Siddharth Ravichandran, Venky Sundaram, and Rao R. Tummala. 2018. “3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components.” Journal of Microelectronics and Electronic Packaging 15 (3): 107–16. https://doi.org/10.4071/imaps.656641.