ISSN 1551-4897
Vol. 15, Issue 3, 2018July 01, 2018 EDT
A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement
A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement
Bharath R. Bharadwaj, SriNithish Kandagadla, Praveen J. Nadkarni, V. Krishna, T. R. Seetharam, K. N. Seetharamu,
Articles in Vol. 15, Issue 3, 2018
Vol. 15, Issue 3, 2018
- 3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF ComponentsZihan WuJunki MinMarkondeya Raj PulugurthaSiddharth RavichandranVenky SundaramRao R. Tummala
- A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered ArrangementBharath R. BharadwajSriNithish KandagadlaPraveen J. NadkarniV. KrishnaT. R. SeetharamK. N. Seetharamu
- Reliability of Novel Ceramic Encapsulation Materials for Electronic PackagingStefan KaessnerMarkus G. ScheibelStefan BehrendtBianca BoettgeChristoph BertholdKlaus G. Nickel
- Thermal Stress Analysis for High CRI LED Indoor Lighting ModuleJonghwan LeeKi-Youn Kwon
- Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless PackagingBijan K. TehraniRyan A. BahrManos M. Tentzeris
Bharadwaj, Bharath R., SriNithish Kandagadla, Praveen J. Nadkarni, V. Krishna, T. R. Seetharam, and K. N. Seetharamu. 2018. “A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement.” Journal of Microelectronics and Electronic Packaging 15 (3): 117–25. https://doi.org/10.4071/imaps.658722.