Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

Stefan Kaessner; Markus G. Scheibel; Stefan Behrendt; Bianca Boettge; Christoph Berthold; Klaus G. Nickel

doi:10.4071/imaps.661015

Kaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. 2018. “Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 15 (3): 132–39. https://doi.org/10.4071/imaps.661015.

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Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

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