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Vol. 9, Issue 1, 2012January 01, 2012 EDT

Design and Characterization of a Biocompatible Packaging Concept for Implantable Electronic Devices

Maaike Op de Beeck, Karen Qian, Paolo Fiorini, Karl Malachowski, Chris Van Hoof,
Biocompatibilitybiomedical devicehermeticityimplantable packaging
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.314
Journal of Microelectronics & Elect Pkg
Beeck, Maaike Op de, Karen Qian, Paolo Fiorini, Karl Malachowski, and Chris Van Hoof. 2012. “Design and Characterization of a Biocompatible Packaging Concept for Implantable Electronic Devices.” Journal of Microelectronics and Electronic Packaging 9 (1): 43–50. https:/​/​doi.org/​10.4071/​imaps.314.
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