ISSN 1551-4897
Articles in Vol. 6, Issue 2, 2009
Vol. 6, Issue 2, 2009
- Mixed LTCC and LTTT Technology for Microplasma Generator FabricationRoberto K. YamamotoMário R. Gongora-RubioRodrigo S. PessoaMárcio R. CunhaHomero S. Maciel
- Fabrication and Testing of an LTCC Microfluidic Serial Dilution DeviceMarcio Rodrigues da CunhaMario Ricardo Gongora-RubioIzabela Dutra AlvimMaria Ines Ré
- Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis StudyMichael GirardiGregg BarnerCristie LopezBrent DuncanLarry Zawicki
- Qualification Testing of Engineering Camera and Platinum Resistance Thermometer (PRT) Sensors for MSL Project Under Extreme Temperatures to Assess Reliability and to Enhance Mission AssuranceRajeshuni RameshamJustin N. MakiGordon C. Cucullu
- Solder Joint Reliability on 3-D MID LCP SubstratesMinna ArraEsko J PääkkönenIlkka Härkönen
- Chip on Board Packaging and Thermal Solutions for a 100 W Large Monolithic LEDJay G. LiuDaxi XiongPaul Panaccione
- Split-Post and Split-Cylinder Resonator Techniques: A Comparison of Complex Permittivity Measurement of Dielectric SubstratesMichael D. JanezicJerzy Krupka
- IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA PackagesSang Ha KimHiroshi TabuchiChika KakegawaHan Park
Arra, Minna, Esko J Pääkkönen, and Ilkka Härkönen. 2009. “Solder Joint Reliability on 3-D MID LCP Substrates.” Journal of Microelectronics and Electronic Packaging 6 (2): 135–42. https://doi.org/10.4071/1551-4897-6.2.135.