ISSN 1551-4897
Vol. 6, Issue 2, 2009April 01, 2009 EDT
Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study
Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study
Articles in Vol. 6, Issue 2, 2009
Vol. 6, Issue 2, 2009
- Mixed LTCC and LTTT Technology for Microplasma Generator FabricationRoberto K. YamamotoMário R. Gongora-RubioRodrigo S. PessoaMárcio R. CunhaHomero S. Maciel
- Fabrication and Testing of an LTCC Microfluidic Serial Dilution DeviceMarcio Rodrigues da CunhaMario Ricardo Gongora-RubioIzabela Dutra AlvimMaria Ines Ré
- Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis StudyMichael GirardiGregg BarnerCristie LopezBrent DuncanLarry Zawicki
- Qualification Testing of Engineering Camera and Platinum Resistance Thermometer (PRT) Sensors for MSL Project Under Extreme Temperatures to Assess Reliability and to Enhance Mission AssuranceRajeshuni RameshamJustin N. MakiGordon C. Cucullu
- Solder Joint Reliability on 3-D MID LCP SubstratesMinna ArraEsko J PääkkönenIlkka Härkönen
- Chip on Board Packaging and Thermal Solutions for a 100 W Large Monolithic LEDJay G. LiuDaxi XiongPaul Panaccione
- Split-Post and Split-Cylinder Resonator Techniques: A Comparison of Complex Permittivity Measurement of Dielectric SubstratesMichael D. JanezicJerzy Krupka
- IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA PackagesSang Ha KimHiroshi TabuchiChika KakegawaHan Park
Girardi, Michael, Gregg Barner, Cristie Lopez, Brent Duncan, and Larry Zawicki. 2009. “Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study.” Journal of Microelectronics and Electronic Packaging 6 (2): 114–18. https://doi.org/10.4071/1551-4897-6.2.114.