ISSN 1551-4897
Vol. 5, Issue 1, 2008January 01, 2008 EDT
Photoimageable Thick-Film Components for a Ceramic Analytical Microsystem
Photoimageable Thick-Film Components for a Ceramic Analytical Microsystem
Articles in Vol. 5, Issue 1, 2008
Vol. 5, Issue 1, 2008
- Development of Reliability Allocation and Assessment Algorithms for Designing Multilevel Microelectronic SystemsInjoong KimRaghuram V. PuchaRussell S. PeakSuresh K. Sitaraman
- Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)Khalid Z. RajabMira NaftalyEdmund H. LinfieldJuan C. NinoDaniel ArenasDavid TannerRaj MittraMichael Lanagan
- A Real-Time Precision Characterization Technique for Low-Loss Optical Polymeric Waveguide and Lightwave CircuitsFengtao WangFuhan LiuGee-Kung ChangMathew Q. YaoAli AdibiRao Tummala
- Fatigue Prediction of Electronic Packages Subjected to Random VibrationsS. SaravananM.I. SakriP.V. Mohanram
- Photoimageable Thick-Film Components for a Ceramic Analytical MicrosystemBarbara DziurdziaZbigniew MagonskiStanislaw Nowak
- An Improved Closed-Form Solution for Shearing and Peeling Stresses of Trimaterial Assembly in Electronic PackagingD. SujanM.V.V. MurthyA.Y. HassanK.N. Seetharamu
Dziurdzia, Barbara, Zbigniew Magonski, and Stanislaw Nowak. 2008. “Photoimageable Thick-Film Components for a Ceramic Analytical Microsystem.” Journal of Microelectronics and Electronic Packaging 5 (1): 8–11. https://doi.org/10.4071/1551-4897-5.1.8.