ISSN 1551-4897
Vol. 5, Issue 1, 2008January 01, 2008 EDT
Fatigue Prediction of Electronic Packages Subjected to Random Vibrations
Fatigue Prediction of Electronic Packages Subjected to Random Vibrations
Articles in Vol. 5, Issue 1, 2008
Vol. 5, Issue 1, 2008
- Development of Reliability Allocation and Assessment Algorithms for Designing Multilevel Microelectronic SystemsInjoong KimRaghuram V. PuchaRussell S. PeakSuresh K. Sitaraman
- Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)Khalid Z. RajabMira NaftalyEdmund H. LinfieldJuan C. NinoDaniel ArenasDavid TannerRaj MittraMichael Lanagan
- A Real-Time Precision Characterization Technique for Low-Loss Optical Polymeric Waveguide and Lightwave CircuitsFengtao WangFuhan LiuGee-Kung ChangMathew Q. YaoAli AdibiRao Tummala
- Fatigue Prediction of Electronic Packages Subjected to Random VibrationsS. SaravananM.I. SakriP.V. Mohanram
- Photoimageable Thick-Film Components for a Ceramic Analytical MicrosystemBarbara DziurdziaZbigniew MagonskiStanislaw Nowak
- An Improved Closed-Form Solution for Shearing and Peeling Stresses of Trimaterial Assembly in Electronic PackagingD. SujanM.V.V. MurthyA.Y. HassanK.N. Seetharamu
Saravanan, S., M.I. Sakri, and P.V. Mohanram. 2008. “Fatigue Prediction of Electronic Packages Subjected to Random Vibrations.” Journal of Microelectronics and Electronic Packaging 5 (1): 31–35. https://doi.org/10.4071/1551-4897-5.1.31.